Electroless plating of a metal layer on an activated substrate

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dc.contributorThe University of Toledo
dc.contributorFry, James L.
dc.contributorUhlenbrock, Stefan
dc.contributorKlein, Rita J.
dc.date1999-07-20
dc.date.accessioned2024-05-24T16:39:44Z
dc.date.available2024-05-24T16:39:44Z
dc.descriptionA method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
dc.formatapplication/pdf
dc.identifierutoledo:1327
dc.identifieriid:utpatents-US5925415
dc.identifierPatent No.: US5925415
dc.identifierAppl. No.: 09/036814
dc.identifier.urihttps://hdl.handle.net/20.500.14324/5934
dc.language.isoeng
dc.publisherUnited States Patent and Trademark Office
dc.rightsNo Copyright - United States
dc.subject427/304
dc.subject427/306
dc.subject427/443.1
dc.titleElectroless plating of a metal layer on an activated substrate
dc.typeText
dc.typepatent

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