Layered electrodes with inorganic thin films and method for producing the same
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Abstract/Description: | A method for the preparation of layered electrodes, including ultramicroelectrodes, through application of a thin film coating of an inorganic material to a conductor by use of chemical vapor deposition. The chemical vapor deposition techniques of the present invention provide a layered electrode that is efficiently and effectively manufactured in a standard reaction chamber at atmospheric pressure. The preferred conductors are carbon fibers and foams, and metal (platinum or gold) wires, meshes and foams. The precursors for the thin film deposition include those that yield thin-films of insulators, semiconductors, metals, and superconductors. During the chemical vapor deposition process, a thin film coating is formed on the conductor by the pyrolytic decomposition of the precursor vapor at the surface of the heated conductor. The hardness and rigidity of the thin film layer imparts durability and structure to the fragile and flexible conductors without significantly increasing the size of the device. The variable parameters in the deposition process are monitored and controlled so that the desired thickness of thin film coating will be obtained. |
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Subject(s): | 204/403.01 204/290.01 204/290.03 204/290.08 204/290.12 204/290.14 204/290.15 204/294 204/403.15 204/419 427/118 427/124 427/249.4 |
Date Issued: | 1995-07-11 |
Title: | Layered electrodes with inorganic thin films and method for producing the same. |
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Name(s): |
The University of Toledo, assignee Kirchhoff, Jon R., inventor Giolando, Dean M., inventor |
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Type of Resource: | text | |
Genre: | patent | |
Publisher: | United States Patent and Trademark Office | |
Other Date: | Date Filed: 1993-11-05 | |
Date Issued: | 1995-07-11 | |
Physical Form: | application/pdf | |
Extent: | 13 p. | |
Abstract/Description: | A method for the preparation of layered electrodes, including ultramicroelectrodes, through application of a thin film coating of an inorganic material to a conductor by use of chemical vapor deposition. The chemical vapor deposition techniques of the present invention provide a layered electrode that is efficiently and effectively manufactured in a standard reaction chamber at atmospheric pressure. The preferred conductors are carbon fibers and foams, and metal (platinum or gold) wires, meshes and foams. The precursors for the thin film deposition include those that yield thin-films of insulators, semiconductors, metals, and superconductors. During the chemical vapor deposition process, a thin film coating is formed on the conductor by the pyrolytic decomposition of the precursor vapor at the surface of the heated conductor. The hardness and rigidity of the thin film layer imparts durability and structure to the fragile and flexible conductors without significantly increasing the size of the device. The variable parameters in the deposition process are monitored and controlled so that the desired thickness of thin film coating will be obtained. | |
Identifier(s): |
utpatents-US5431800 (IID) Patent No.: US5431800 (patno) Appl. No.: 08/147573 (appno) |
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Subject(s): |
204/403.01 204/290.01 204/290.03 204/290.08 204/290.12 204/290.14 204/290.15 204/294 204/403.15 204/419 427/118 427/124 427/249.4 |
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Held by: | United States Patent and Trademark Office (USPTO) Public Search Facility | |
Location: | University of Toledo Digital Repository | |
Rights Statement: | No Copyright - United States | |
In Collections: |