Electroless plating of a metal layer on an activated substrate

A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
Download pdf
Abstract/Description: A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
Subject(s): 427/304
427/306
427/443.1
Date Issued: 1999-07-20
Title: Electroless plating of a metal layer on an activated substrate.
Name(s): The University of Toledo, assignee
Fry, James L., inventor
Uhlenbrock, Stefan, inventor
Klein, Rita J., inventor
Type of Resource: text
Genre: patent
Publisher: United States Patent and Trademark Office
Other Date: Date Filed: 1998-03-09
Date Issued: 1999-07-20
Physical Form: application/pdf
Extent: 6 p.
Abstract/Description: A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
Identifier(s): utpatents-US5925415 (IID)
Patent No.: US5925415 (patno)
Appl. No.: 09/036814 (appno)
Subject(s): 427/304
427/306
427/443.1
Held by: United States Patent and Trademark Office (USPTO) Public Search Facility
Location: University of Toledo Digital Repository
Rights Statement: No Copyright - United States
In Collections: